Trusted & Assured Microelectronics

Mission— DOD Unique NDS RADHARD - Demonstration

This project addresses the dual problems of commanding only a small market share while requiring an expansive range of unique microelectronics needs, from boutique and legacy components to state-of-the-art (SOTA) technologies. The Government must sustain specialty suppliers, given their criticality to national security. In particular, DoD needs access to a diverse microelectronics ecosystem to develop and acquire the application specific integrated circuit (ASICs) and personalized commercial off the shelf (COTS) components required for military radiation hardened and radio frequency and optical needs. The Department frequently relies on commercial suppliers to optimize performance and reduce costs for sophisticated weapon system and secure network functionality. It is critical that the DoD has future access to subject matter expertise, technology, and manufacturing. In addition to radiation hardened microelectronics needs, the DoD requires access to radio frequency (RF) and opto-electronic materials, foundries, and packaging facilities, to enable next generation sensors and communications. The DoD must leverage state-of-the-art microelectronic technologies driven by mega-trends such as 5G wireless and datacenters to combat emerging threats and provide overmatch technology to the warfighter. At the same time, the DoD must fill the gaps which are left unaddressed these dual-use mega-trends to satisfy mission requirements. Partnering in the maturation of state-of-the-art material sources, foundries, and packaging facilities, enables DoD to tailor process development towards unique DoD interests and encourage open access design, stimulating innovation and driving affordability. Additionally, critical investments must be made in the domestic supply chains supporting both RF Gallium Nitride (GaN) and integrated photonics to maintain the integrity and security of the Defense Industrial Base.

Mission— Access to Advanced Packaging and Testing - Demonstration

The DoD needs modern microelectronics capabilities. Advanced packaging provides necessary performance improvements, size weight power and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoD requirements into smaller and lower cost chiplets while maximally leveraging state-of-the-art (SOTA) commercial technologies. However domestic advanced packaging capabilities are limited and the heterogeneous integrated (HI) chiplet ecosystem is nascent. This project collaborates with DoD, Defense Industrial Base (DIB), and domestic commercial industry to leverage and enhance existing capabilities to demonstrate self-sustaining advanced packaging and test solutions that meet DoD needs.

Mission— Access to State-of-the-Art (SOTA) Microelectronics - Demonstration

This project establishes multiple strategic partnerships with existing commercial state-of-the-art (SOTA) domestic foundries to develop a data-driven, evidence-based approach to supply chain protection and demonstrate the assured manufacture of advanced electronic components. Its objectives include keeping pace with the rapid advancements in microelectronics technology globally while maintaining trust and assurance in DoD microelectronics in the light of globalization of this industry sector. Successful implementation will transition these SOTA technologies to use in DoD programs, obtain access to multiple commercial microelectronics facilities, establish secure design capabilities, and practice a data-driven evidence-based approach to supply chain protection. It includes collaborating with industry to apply evidence-based assurance methodologies.

Mission— Trusted and Assured Microelectronics

This effort supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. This program supports microelectronics modernization activities that enable defense systems to keep pace with commercial microelectronics technological advances, reduce reliance on obsolete microelectronics, and mitigate the Department’s reliance on sole source foundries for assured state-of-the-art (SOTA) microelectronics. It addresses the challenges of 1) having enduring access to a multiplicity of modern manufacturing processes that require commercial volumes to maintain long term viability and 2) protecting the intellectual property (IP) of the microelectronic parts that are manufactured. Microelectronics technology is a critical enabler for the development of new systems and sustainment of fielded systems. In addition, this program directly supports the priority of building a resilient Joint Force and defense ecosystem through modernization of key capabilities and fostering pathways to adapt SOTA commercial and dual-use technologies to Defense needs. The program also supports the objective of Making the Right Technology Investments by supporting the domestic microelectronics innovation ecosystem and partnering with industry to quickly incorporate market-driven commercial advances with military-relevant capabilities. Recognizing that an assured supply of microelectronics is a U.S. Government-wide concern, this activity will interface with the services and interagency partners and stakeholders to capture requirements, opportunities for collaboration, and strategic decisions develop capabilities to address multiple missions, to limit the overall cost of these requirements to the USG, limit unneeded duplication, and enable technology transition and adoption. This activity is being led by the Under Secretary of Defense for Research and Engineering.

Accomplishments & Planned Programs (3)