Printed from https://fiscalreceipts.com/program/0605294D8Z/ — data as of August 12, 2026. Every figure is citation-backed; see the page online for per-number provenance.
Trusted & Assured Microelectronics
Budget Figures
$143.5M discretionary + $26.0M one-time reconciliation. Discretionary change vs FY2025 enacted: -4.6%.
Two official figures, one label— reconciled below
Fiscal Receipts uses P-1/R-1 workbook total obligation authority (TOA) as the headline figure sitewide. The workbook TOA includes budget rows (such as advance procurement) that the R-2/P-40 J-book program line excludes. How the two bases relate →
FY26 Request · $169.5M TOA − $143.5M J-book line = 26.0M (169.5 − 143.5 = 26.0)
Figures in the sentence are rounded for reading; the parenthesised arithmetic is the same subtraction in USD millions, at the precision where it closes.
FY2026 award data is a partial year — USASpending awards are reported on a rolling basis and the fiscal year does not close until September 30. why partial FY2026 data? →
| Fiscal year | Amount |
|---|---|
| FY24 | $202.8M |
| FY25 | $150.4M |
| FY26 | $169.5M |
All series figures: R-1 TOA · PB2026
The vertical scale does not start at zero: the baseline sits just below this program’s smallest year, so a low point on this line is not a small amount. Read the shape for direction and the grid below for the figures.
● actuals (line) · ○ enacted · ◇ request — gaps are editions the program is absent from, never interpolated.
| Series | FY16 | FY17 | FY18 | FY19 | FY20 | FY21 | FY22 | FY23 | FY24 | FY25 | FY26 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Actuals | $0 | $0 | $59.5M | $94.6M | $170.8M | $104.2M | $111.2M | $245.4M | $202.8M | ||
| Enacted | – | $0 | $61.1M | $96.0M | $175.0M | $107.5M | $113.5M | $253.0M | $297.6M | $150.4M | |
| Request | – | $61.1M | $56.2M | $175.0M | $107.6M | $113.9M | $303.0M | $297.6M | $150.4M | $169.5M |
blank = series not published for this year; – = absent from that edition.
Asked vs spent: the PB2024 book requested $297.6M for FY2024; the PB2026 book reported $202.8M as actual total obligation authority — $94.8M below the request. 202.8 − 297.6 = -94.8 USD millions — the compact figures above are rounded for reading.
Program Lineage
No stated lineage edges for this program element — only the candidate connections below, which are inferred and unverified.
Show possible connections (1 candidate, unverified)
These edges are inferred from program-element and budget-activity structure, not stated in any J-book sentence — treat them as leads, not facts.
- BA-maturation · FY2021 · BA4candidate (unverified)
Description
Mission — Trusted and Assured Microelectronics
This effort supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. This program supports microelectronics modernization activities that enable defense systems to keep pace with commercial microelectronics technological advances, reduce reliance on obsolete microelectronics, and mitigate the Department’s reliance on sole source foundries for assured state-of-the-art (SOTA) microelectronics. It addresses the challenges of 1) having enduring access to a multiplicity of modern manufacturing processes that require commercial volumes to maintain long term viability and 2) protecting the intellectual property (IP) of the microelectronic parts that are manufactured. Microelectronics technology is a critical enabler for the development of new systems and sustainment of fielded systems. In addition, this program directly supports the priority of building a resilient Joint Force and defense ecosystem through modernization of key capabilities and fostering pathways to adapt SOTA commercial and dual-use technologies to Defense needs. The program also supports the objective of Making the Right Technology Investments by supporting the domestic microelectronics innovation ecosystem and partnering with industry to quickly incorporate market-driven commercial advances with military-relevant capabilities. Recognizing that an assured supply of microelectronics is a U.S. Government-wide concern, this activity will interface with the services and interagency partners and stakeholders to capture requirements, opportunities for collaboration, and strategic decisions develop capabilities to address multiple missions, to limit the overall cost of these requirements to the USG, limit unneeded duplication, and enable technology transition and adoption. This activity is being led by the Under Secretary of Defense for Research and Engineering.
Mission — Access to State-of-the-Art (SOTA) Microelectronics - Demonstration
This project establishes multiple strategic partnerships with existing commercial state-of-the-art (SOTA) domestic foundries to develop a data-driven, evidence-based approach to supply chain protection and demonstrate the assured manufacture of advanced electronic components. Its objectives include keeping pace with the rapid advancements in microelectronics technology globally while maintaining trust and assurance in DoD microelectronics in the light of globalization of this industry sector. Successful implementation will transition these SOTA technologies to use in DoD programs, obtain access to multiple commercial microelectronics facilities, establish secure design capabilities, and practice a data-driven evidence-based approach to supply chain protection. It includes collaborating with industry to apply evidence-based assurance methodologies.
Mission — Access to Advanced Packaging and Testing - Demonstration
The DoD needs modern microelectronics capabilities. Advanced packaging provides necessary performance improvements, size weight power and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoD requirements into smaller and lower cost chiplets while maximally leveraging state-of-the-art (SOTA) commercial technologies. However domestic advanced packaging capabilities are limited and the heterogeneous integrated (HI) chiplet ecosystem is nascent. This project collaborates with DoD, Defense Industrial Base (DIB), and domestic commercial industry to leverage and enhance existing capabilities to demonstrate self-sustaining advanced packaging and test solutions that meet DoD needs.
Mission — DOD Unique NDS RADHARD - Demonstration
This project addresses the dual problems of commanding only a small market share while requiring an expansive range of unique microelectronics needs, from boutique and legacy components to state-of-the-art (SOTA) technologies. The Government must sustain specialty suppliers, given their criticality to national security. In particular, DoD needs access to a diverse microelectronics ecosystem to develop and acquire the application specific integrated circuit (ASICs) and personalized commercial off the shelf (COTS) components required for military radiation hardened and radio frequency and optical needs. The Department frequently relies on commercial suppliers to optimize performance and reduce costs for sophisticated weapon system and secure network functionality. It is critical that the DoD has future access to subject matter expertise, technology, and manufacturing. In addition to radiation hardened microelectronics needs, the DoD requires access to radio frequency (RF) and opto-electronic materials, foundries, and packaging facilities, to enable next generation sensors and communications. The DoD must leverage state-of-the-art microelectronic technologies driven by mega-trends such as 5G wireless and datacenters to combat emerging threats and provide overmatch technology to the warfighter. At the same time, the DoD must fill the gaps which are left unaddressed these dual-use mega-trends to satisfy mission requirements. Partnering in the maturation of state-of-the-art material sources, foundries, and packaging facilities, enables DoD to tailor process development towards unique DoD interests and encourage open access design, stimulating innovation and driving affordability. Additionally, critical investments must be made in the domestic supply chains supporting both RF Gallium Nitride (GaN) and integrated photonics to maintain the integrity and security of the Defense Industrial Base.
Justification
Accomplishments & Planned Programs (3)
Access to State-of-the-Art (SOTA) Microelectronics - Demonstration
This project implements multiple foundries and process design kits (PDKs) to provide resilience in manufacturing resources to satisfy the government’s needs to fabricate critical microelectronic components; that is to reduce dependence single sources. Hardware solutions are demonstrated through dedicated and multi-project wafer runs at multiple foundries. Commercial foundries generate enormous amounts of data as part their quality assurance practices to improve reliability and increase yield. This project collects and utilizes these data within the evidence-based assurance methodology to allow quantitative comparison of performance and security metrics in the design and test stages of the microelectronics lifecycle, thereby mitigating risk. Secure Design Environment: The Rapid Assured Microelectronic Prototypes (RAMP) This effort established the ability to fabricate secure, controlled DoD designs in on-shore commercial foundries. The effort established multiple strategic partnerships with existing commercial domestic microelectronics design vendors and foundries to develop a data-driven, risk-based approach to supply chain protection and demonstrated assured manufacture of advanced electronic components. This effort demonstrated the technical means for protecting intellectual property (IP)and informed decision makers responsible for updates to export regulations applicable to advanced microelectronics technologies. Rapid Assured Microelectronic Prototypes – Commercial (RAMP-C): This effort has enabled the DoD and the defense industrial base to collaborate with the commercial microelectronics industry to develop, prototype, demonstrate, and address the DoD’s need to maintain and modernize weapon systems as the threat landscape shifts. This effort enables the T&AM program to demonstrate, by end of FY 2025, full access to U.S. commercial state-of-the-art (SOTA) design, foundry, and advanced packaging capability and meet DoD’s unique needs within two to three years for modernization, including for rad-hard and photonics applications. The capability will reduce the time needed to replace microelectronics components that are generations behind the commercial sector, move away from off-shore sources for SOTA commercial integrated circuits, and accelerate the demonstration and adoption of evidence-based assurance methods throughout the microelectronics lifecycle and supply chain. This project readies the Department to take full advantage of the Secure Enclave.
Access to Advanced Packaging and Testing - Demonstration
This project is demonstrating the adoption of chiplets and advanced packaged microelectronics to meet DoD requirements. The Stimulating Transition for Advanced Microelectronics Packaging (STAMP) effort works with DoD program offices and the defense industrial base (DIB) partners to address residual risks to enable transition of multi-chip packaging (MCP) prototypes into DoD systems. This project utilized the Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) contract to ensure additional HI and chiplet prototypes follow the identified transition strategy into DoD systems. Additionally, the Government Lab Advanced Microelectronics – Evaluation & Reporting (GLAM-ER) effort is providing DoD Government labs access to advanced MCP prototype development kits for the purpose of upskilling the Government workforce and to assess the prototypes capabilities in meeting future DoD requirements.
Access to Radiation Hardened-, RF-, and Opto-Electronic - Demonstration
Government-unique trusted design and manufacturing flows have been developed to enable a tier of trust for select ASIC parts; however, this approach addresses only a small subset of DoD microelectronics requirements (e.g., processors, memory, microcontrollers, field programmable gate arrays (FPGAs), and radiation-tolerant processors). The DoD will partner with the intelligence community, the Department of Energy, and the National Aeronautics and Space Administration to demonstrate radiation hardened components that permit systems to operate in space and other harsh environments. State-of-the-practice (SOTP) and SOTA technologies will be characterized and developed in support of Radiation Hardened By Process (RHBP) and Radiation Hardened By Design (RHBD) activities in support the DoD modernization programs with radiation hardened requirements. Beyond complementary metal-oxide semiconductor (CMOS) and radiation hardened microelectronics, radio frequency (RF)- and opto-electronic (RF/OE) technologies represent critically enable asymmetric DoD capabilities as well as domestic dual-use industrial base capabilities. RF/OE investments will demonstrate RF Gallium Nitride (GaN) and integrated photonic material sources, foundries, and packaging facilities. These investments will break microelectronics bottlenecks which directly enable compact millimeter wave transceivers and artificial intelligence training for edge compute.
Budget Line Items(workbook-cited)
P-1/R-1 workbook Total Obligation Authority basis (USD thousands) · PB2026.
Exhibit R-1
| Account | Org | Type | Amount |
|---|---|---|---|
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY24 Actuals | $202.8M |
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY25 Enacted | $150.4M |
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY25 Total | $150.4M |
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY26 Disc. Request | $143.5M |
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY26 Reconciliation | $26.0M |
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY26 Total | $169.5M |
Budget Details(R-2/P-40 facts)
J-book detail basis (R-2/P-40, USD millions) · PB2026 — a different accounting basis from the P-1/R-1 workbook TOA above; where the two disagree, the reconciliation strip under Budget Figures shows both.
Wider than this screen — swipe the table sideways for the remaining fiscal-year columns.
| Project | All Prior Years | FY24 Actuals | FY25 Total | FY26 Base | FY26 Request |
|---|---|---|---|---|---|
| Program Element | $785.7M | $202.8M | $150.4M | $143.5M | $143.5M |
| 902: Access to State-of-the-Art (SOTA) Microelectronics - Demonstration | $548.4M | $140.8M | $95.3M | $87.2M | $87.2M |
| 903: Access to Advanced Packaging and Testing - Demonstration | $177.3M | $33.9M | $30.2M | $30.0M | $30.0M |
| 905: DOD Unique NDS RADHARD - Demonstration | $60.0M | $28.1M | $24.9M | $26.3M | $26.3M |
No follow-the-dollar view — this program's awards haven't been crosswalked at high confidence (flows cover 17 of 1,741 programs). why coverage is partial? →
Awards
No awards are linked to this program element at high confidence — the budget→award crosswalk only asserts links it can defend, and this line has none yet.
Lobbying Mentions
1 mention from the Senate LDA disclosure database.
Legislative & Regulatory Issues Related to Defense Matters: Public Law no. 118-31, National Defense Authorization Act…
Oversight
Department-level designation (not specific to this program)
GAO lists 5 high-risk areas for DOD as a whole. That designation covers the department, not Trusted & Assured Microelectronics — no program-specific GAO finding for this line is in the ingested data. See the DOD oversight record.
No research dossier for this program — dossiers cover 50 of 1,741 programs, the largest fully J-book-detailed lines by FY2026 requested dollars. why no dossier here? →