Printed from https://fiscalreceipts.com/program/0604294D8Z/ — data as of August 12, 2026. Every figure is citation-backed; see the page online for per-number provenance.
Trusted & Assured Microelectronics
Budget Figures
FY2026 award data is a partial year — USASpending awards are reported on a rolling basis and the fiscal year does not close until September 30. why partial FY2026 data? →
| Fiscal year | Amount |
|---|---|
| FY24 | $687.7M |
| FY25 | $537.2M |
| FY26 | $512.2M |
All series figures: R-1 TOA · PB2026
The vertical scale does not start at zero: the baseline sits just below this program’s smallest year, so a low point on this line is not a small amount. Read the shape for direction and the grid below for the figures.
● actuals (line) · ○ enacted · ◇ request — gaps are editions the program is absent from, never interpolated.
| Series | FY16 | FY17 | FY18 | FY19 | FY20 | FY21 | FY22 | FY23 | FY24 | FY25 | FY26 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Actuals | $0 | $0 | $147.5M | $517.4M | $534.3M | $489.3M | $682.1M | $624.3M | $687.7M | ||
| Enacted | – | $0 | $83.6M | $523.0M | $547.4M | $503.8M | $704.1M | $644.3M | $810.8M | $537.2M | |
| Request | – | $83.6M | $233.1M | $542.4M | $489.1M | $509.2M | $647.2M | $810.8M | $593.6M | $512.2M |
blank = series not published for this year; – = absent from that edition.
Asked vs spent: the PB2019 book requested $233.1M for FY2019; the PB2021 book reported $517.4M as actual total obligation authority — $284.2M above the request. 517.356 − 233.142 = 284.214 USD millions — the compact figures above are rounded for reading.
Program Lineage
No stated lineage edges for this program element — only the candidate connections below, which are inferred and unverified.
Show possible connections (1 candidate, unverified)
These edges are inferred from program-element and budget-activity structure, not stated in any J-book sentence — treat them as leads, not facts.
- BA-maturation · FY2021 · BA5candidate (unverified)
Description
Mission — Trusted and Assured Microelectronics
This program supports microelectronics modernization activities that enable defense systems to keep pace with commercial microelectronics technological advances, reduce reliance on obsolete microelectronics, and mitigate the Department’s reliance on sole source foundries for assured state-of-the-art (SOTA) microelectronics. It addresses the challenges of 1) having enduring access to a multiplicity of modern manufacturing processes that require commercial volumes to maintain long term viability and 2) protecting the intellectual property (IP) of the microelectronic parts that are manufactured. Microelectronics technology is a critical enabler for the development of new systems and sustainment of fielded systems. In addition, this program directly supports the priority of building a resilient Joint Force and defense ecosystem through modernization of key capabilities and fostering pathways to adapt SOTA commercial and dual-use technologies to Defense needs. This program also supports the objective of Making the Right Technology Investments by supporting the domestic microelectronics innovation ecosystem and partnering with industry to quickly incorporate market-driven commercial advances with military-relevant capabilities. This program supports the OUSD(R&E) Microelectronics Modernization Roadmap. The primary areas of focus of this roadmap include the following: access to state-of-the-art microelectronics technology, access to advanced packaging and test; access to the best commercial design technology; evidence-based assurance and secure design; foundry access; policies, standards, and Joint Federated Assurance Center (JFAC) governing body; access to radiation hardened microelectronics; access to non-complementary metal oxide semiconductor state-of-the-art (SOTA) microelectronics for radio frequency and optoelectronic applications; education and workforce development; and supply chain awareness and security. Recognizing that an assured supply of microelectronics is a U.S. Government (USG)-wide concern, this activity will interface with interagency partners and stakeholders to capture interagency requirements, opportunities for collaboration, and strategic decisions that can be made to limit the overall cost of these requirements to the USG, limit unneeded duplication, and enable technology transition and adoption. This activity is being led by the Under Secretary of Defense for Research and Engineering.
Mission — Access to State-of-the-Art (SOTA) Microelectronics - Development
Microelectronics are critical technologies that drive the modern economy and enable the defense systems that allow warfighters to accomplish their missions. Other nations recognize the need to control the microelectronics supply chain and indigenous state-of-the-art (SOTA) manufacturing. Aggressive investments and licit and illicit actions by peer nations threaten U.S. leadership. China alone purports investment of $150 billion and a national strategy to achieve dominance in all major areas of microelectronics by 2030. Russia and China have publicly stated that advanced microelectronics, AI, and machine learning (ML) are the keys to economic and military dominance. This project funds the operation of microelectronics software assurance (SwA) support to DoD programs and organizations of the Joint Federated Assurance Center (JFAC), codified in the National Defense Authorization Act (NDAA) for Fiscal Year 2025, Sec 922, to support the assurance needs of the Department of Defense by ensuring, pursuant to policies related to hardware and software assurance and supply chain risk management, that the software and hardware developed, acquired, maintained, and used by the Department are free from intentional and unintentional vulnerability during the life-cycle of development and deployment of assured, trustworthy defense systems. The collaboration between the JFAC and program offices will help mitigate existing and emerging critical threats and vulnerabilities in microelectronics to all DoD programs. The project supports the implementation of Executive Order 14028 Improving the Nation’s Cybersecurity for software assurance for critical software such as software bill of materials, and information communications technology supply chain risk management, and the PD, Cyber Roadmap for mitigation of software vulnerabilities that are cyber related. This project includes establishment of new strategic partnerships with existing commercial SOTA domestic foundries to develop a data-driven, risk- based approach to supply chain protection and develop the assured access, secure design, and manufacture of advanced microelectronics technology and electronic components. Successful implementation will transition these technologies to use in DoD programs, obtain access to multiple commercial microelectronics facilities, establish secure design capabilities, and solidify a data-driven approach to supply chain protection. It also includes keeping pace with the rapid advancements in microelectronics technology and the globalization of this industry sector. It will provide the basics for updating and strengthening DoD assurance policy and includes collaborating with industry to develop data driven evidence-based practices.
Mission — Access to Advanced Packaging and Testing - Development
The DoD needs modern microelectronics capabilities. Advanced packaging provides necessary performance improvements, size weight power and cost (SWAP-C) benefits, and unique opportunities to disaggregate DoD requirements into smaller and lower cost chiplets while maximally leveraging state-of-the-art (SOTA) commercial technologies. However domestic advanced packaging capabilities are limited and the heterogeneous integrated (HI) chiplet ecosystem is nascent. This project collaborates with DoD, the Defense Industrial Base (DIB), and domestic commercial industry to leverage and enhance existing capabilities to develop self-sustaining advanced packaging and test solutions that meet DoD needs.
Mission — DOD Unique Needs RADHARD
This project addresses Government needs for microelectronics that represent only a small market share while spanning a wide range of devices, from legacy components to state-of-the-art (SOTA) technologies. The Government must sustain specialty suppliers and maintain access to a diverse microelectronics ecosystem to develop and acquire the application specific integrated circuits (ASICs) and specialized or modified commercial off the shelf (COTS) components required to satisfy military needs for radiation hardened, radio frequency (RF) and optoelectronic (OE) microelectronics. By partnering in the maturation of state-of-the-art material sources, foundries, and packaging facilities, the DoD is able to develop the ability to align commercial practices with DoD needs for unique functionality and encourage open access design to stimulate innovation and drive affordability. Subject matter expertise, technology, and manufacturing capability and capacity, including fabrication, packaging and test, are all needed. Moreover, domestic supply chains must be made more stable for both RF Gallium Nitride (GaN) and integrated photonics availability, integrity and security for the Department and the Defense Industrial Base.
Mission — ME U.S. ME Dominance-Dev
This project will promote microelectronics innovation and create an evidence-based assured microelectronics pipeline including maintaining Joint Federated Assurance Center (JFAC) strategic partnerships, assuring field programmable gate array (FPGA) devices, supply chain awareness and security, and workforce development. It will slow and, in the long-term, reverse offshoring trends by fostering commercial and Government alliances to preserve the U.S. ecosystem, lower barriers to innovation and adoption, strengthen workforce expertise, and ensure DoD has access to the next generation of advanced technology by utilizing an evidence-based assurance approach. This approach enables management of microelectronics security that is commensurate with program risk throughout the product pipeline and maintain the United States as the global source for high- end, secure, and reliable microelectronics components. In addition, this project will develop a new data driven risk-based assurance paradigm for supply chain protection. This paradigm will strengthen security while improving access, without exposing sensitive intellectual property (IP) to the foundry and requiring post-manufacture validation of foundry products. The enhancement will develop evidence-based assured design concepts in manufactured systems, enabling a formal risk-based approach to protection techniques. Manufactured microelectronics will be tested to ensure that IP protections meet or exceed current National Security Agency standards for IP protection, and to develop DoD’s ability to detect certain malicious supply chain attacks on DoD microelectronics.
Mission — Defense Microelectronics CFT
Microelectronics components are the foundation of modern military systems. The Department of Defense (DoD) is exposed to various vulnerabilities that threaten the ability to source microelectronics needed to sustain programs of record. To prepare the Department for Great Power Competition, the DoD must take action to ensure access to the microelectronic components needed to sustain our defense programs and systems effectively and affordably. The Department also needs a better strategy to transition leading edge technology developed by both government and industry to DoD programs of record, to ensure the Department maintains a competitive edge.
Justification
Accomplishments & Planned Programs (6)
Joint Federated Assurance Center (JFAC)
This project’s activities will advance the state of the art for evidence-based software assurance tools and methods practiced by the JFAC labs to enhance both microelectronics hardware and software assurance for the DoD enterprise. The project accelerates the development of assurance technologies to ensure the integrity of DoD weapon systems, information systems, and national security systems in direct support of program offices across the microelectronics life cycle. The JFAC bridges the various federated DoD organizations across the Joint Services and the National Security Agency (NSA). The JFAC advances the development of assurance technologies, offers scalable enterprise assurance capabilities, fosters a thriving assurance ecosystem, and provides access to leading assurance solutions to include policies, guidance, best practices, training, resources, tools, assessments, expertise, source code, and data.
Access to State-of-the-Art (SOTA) Microelectronics - Development
This activity supports resilience in sources for Department microelectronics by implementing manufacturing capability at multiple foundries ensuring the government is not dependent on one single source for critical components. Design and fabricate advanced microelectronics utilizing state-of-the-art electronic design automation (EDA) tools and process development kits (PDKs). Demonstrate hardware through dedicated and multi-project wafer runs at multiple foundries. Rapid Assured Microelectronic Prototypes – Commercial (RAMP-C): This project enables the DoD and the defense industrial base to collaborate with the commercial microelectronics industry to increase prototype development, demonstration, and address the war fighter’s need to maintain and modernize weapon systems as the threat landscape shifts. This project enables the Trusted and Assured Microelectronics (T&AM) program to demonstrate, by end of FY 2025, full access to U.S. commercial state-of-the-art (SOTA) design, foundry, and advanced packaging capability and meet DoD’s unique needs within two to three years for modernization, including for radiation hardened (RH) and photonics applications. The capability will reduce the time needed to replace microelectronics components that are generations behind the commercial sector, move away from off-shore sources for SOTA commercial integrated circuits, and accelerate the demonstration and adoption of evidence-based assurance methods throughout the microelectronics lifecycle and supply chain. Secure Manufacturing: This project builds capability in the government and the defense industrial base (DIB) to design and manufacture in the most advanced onshore microelectronics fabrication technologies. By moving innovative microelectronic device concepts from older technologies (e.g., 12 nm) to 1.8nm, the DoD can achieve improvements in performance parameters such as latency, bandwidth, and size, weight and power (SWaP) for critical EW, sensing and communications missions. This project readies the Department to take full advantage of the Secure Enclave.
Access to Advanced Packaging and Testing - Development
Description: This project is developing chiplets and advanced packaged microelectronics informed by DoD requirements. It leverages domestic heterogeneous integrated (HI) packaging technologies to accelerate DoD adoption of the most advanced microelectronics available. Key technologies, processes and tools will be developed and improved upon, allowing DoD to utilize HI technologies to package chips and chiplets to realize performance and SWAP-C benefits. The SOTA Heterogeneous Integrated Packaging (SHIP) contract provides access to dual-use heterogeneous packaged digital and RF microelectronics and manufacturing processes. Working with world-class industrial partners will provide early access to proprietary information related to these technologies, giving DoD an asymmetrical advantage. It will enable personalization of, and customization for supporting DoD programs. It enables a revolutionary leap in system performance that will greatly reduce SWaP by incorporating the immense advances in SOTA commercial off the shelf (COTS) processing technologies, such as field programmable gate arrays (FPGAs), microprocessors, and Graphic Processing Units (GPUs). The Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) contract develops additional HI and chiplet prototypes with an emphasis on transition strategy and identified impact to DoD systems. In order to meet the project mission, further work is needed. Testing of advanced MCP technologies in DoD relevant environments will occur. Access to advanced packaging processes with capabilities to support ITAR will be developed. Detailed studies of the chiplet and SOTA HI packaging ecosystem and barriers to DIB use will continue. Identification of DoD and DIB advanced packaging and chiplet needs will be refined. Solutions to drive down cost and schedule will be developed.
Access to Radiation Hardened-, RF-, and Opto-Electronic Development
Government-unique trusted design and manufacturing flows have been developed to enable a tier of trust for select ASIC parts including processors, memory, microcontrollers, field programmable gate arrays (FPGAs), and radiation-tolerant processors. DoD has partnered with the intelligence community, the Department of Energy, and the National Aeronautics and Space Administration to develop radiation hardened components that permit systems to operate in space and other harsh environments. State-of-the-practice (SOTP) and state-of-the-art (SOTA) technologies will be characterized and developed in support of Radiation Hardened By Process (RHBP) and Radiation Hardened By Design (RHBD) activities to satisfy radiation hardened requirements of DoD modernization programs. Radio frequency (RF)- and opto-electronic (RF/OE) technologies are critical enablers of asymmetric DoD capabilities for communications in congested regions of the spectrum and efficient data transfer as well as domestic dual-use industrial base capabilities. RF/OE efforts are developing and demonstrating RF Gallium Nitride (GaN) and integrated photonic material sources, foundries, and packaging resources and facilities. These investments will break microelectronics bottlenecks to enable compact millimeter wave transceivers and artificial intelligence training for edge compute.
Create an Evidence-Based Assured Microelectronics Pipeline – Development
DoD is investing in next-generation disruptive technology, leveraging U.S. innovation, and transitioning materials, architectures, and designs into prototype capabilities for use by multiple industrial sectors. This and additional targeted investments in workforce will begin to address long-term talent needs. In addition, the Department will continue to enhance its partnership with industry to mitigate supply chain risks. Significant increases in assurance and protection of DoD technical data and components will be achieved through improvements in design practices, modern commercial security practices, and advanced packaging and chain of custody technologies. This activity, along with continued engagements and partnerships with industry will foster necessary security features in commercial products and infrastructure that will facilitate long-term assured access for the U.S. Government to commercial advanced state-of-the-art (SOTA) technology providers. This project funds the operation hardware assurance (HwA) support to DoD programs and organizations of the Joint Federated Assurance Center (JFAC), established in National Defense Authorization Act (NDAA) Sec 937, to increase DoD’s HwA by providing engineering tools, technical services, best practices, innovative technologies and other assistance to programs to detect, assess, prioritize, and mitigate vulnerabilities from hardware attacks and assurance against supply chain exploitation vulnerabilities. The JFAC will provide capabilities for programs to keep assessment findings throughout the life cycle of their systems for data mining (e.g., documentation on rationale for previous mitigation decisions). The collaboration between the JFAC and program offices will help mitigate existing and emerging critical threats and vulnerabilities in hardware available to all DoD programs. DoD is required to establish assured supply chain and operational security standards for the purchase of all (Commercial and Custom) microelectronics and protection of Intellectual Property across the entire lifecycle. An evidence-based assurance approach addresses FY 2020 NDAA Sec 224 requirement for trusted supply chain and operational security standards. Accelerate the adoption of an evidence-based assurance approach with multiple DoD pilot programs. This includes developing program guidance on baseline threats and mitigations per required level of assurance. This requires working closely with commercial industry, the defense industrial base and government JFAC subject matter experts.
Defense Microelectronics Cross-Functional Team Funding
A Cross-Functional Team (CFT) was established effective January 2021 to develop a DoD strategy and implementation and transition plan to minimize vulnerabilities within the Department's microelectronic supply chain. The transition plan will be comprehensive, and include a budget plan. The CFT will function as an advisory body to the Deputy Secretary of Defense (DSD), the Under Secretary of Defense for Research and Engineering (USD(R&E)), the Under Secretary of Defense for Acquisition and Sustainment (USD(A&S)) to strengthen the domestic microelectronics supply chain.
Budget Line Items(workbook-cited)
P-1/R-1 workbook Total Obligation Authority basis (USD thousands) · PB2026.
Exhibit R-1
| Account | Org | Type | Amount |
|---|---|---|---|
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY24 Actuals | $687.7M |
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY25 Enacted | $537.2M |
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY25 Total | $537.2M |
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY26 Disc. Request | $512.2M |
| Research, Development, Test and Evaluation, Defense-Wide | OSD | FY26 Total | $512.2M |
Budget Details(R-2/P-40 facts)
J-book detail basis (R-2/P-40, USD millions) · PB2026 — a different accounting basis from the P-1/R-1 workbook TOA above; where the two disagree, the reconciliation strip under Budget Figures shows both.
Wider than this screen — swipe the table sideways for the remaining fiscal-year columns.
| Project | All Prior Years | FY24 Actuals | FY25 Total | FY26 Base | FY26 Request |
|---|---|---|---|---|---|
| Program Element | $2.99B | $687.7M | $537.2M | $512.2M | $512.2M |
| 907: Access to State-of-the-Art (SOTA) Microelectronics - Development | $2.15B | $232.6M | $148.4M | $116.5M | $116.5M |
| 908: Access to Advanced Packaging and Testing - Development | $222.0M | $68.1M | $82.4M | $90.8M | $90.8M |
| 911: DOD Unique Needs RADHARD | $416.5M | $267.7M | $180.1M | $174.7M | $174.7M |
| 912: ME U.S. ME Dominance-Dev | $204.9M | $115.0M | $126.3M | $130.1M | $130.1M |
| 913: Defense Microelectronics CFT | $3.92M | $4.27M | $0 | $0 | $0 |
No follow-the-dollar view — this program's awards haven't been crosswalked at high confidence (flows cover 17 of 1,741 programs). why coverage is partial? →
Awards
No awards are linked to this program element at high confidence — the budget→award crosswalk only asserts links it can defend, and this line has none yet.
Lobbying Mentions
1 mention from the Senate LDA disclosure database.
Legislative & Regulatory Issues Related to Defense Matters: Public Law no. 118-31, National Defense Authorization Act…
Oversight
Department-level designation (not specific to this program)
GAO lists 5 high-risk areas for DOD as a whole. That designation covers the department, not Trusted & Assured Microelectronics — no program-specific GAO finding for this line is in the ingested data. See the DOD oversight record.
No research dossier for this program — dossiers cover 50 of 1,741 programs, the largest fully J-book-detailed lines by FY2026 requested dollars. why no dossier here? →