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Fiscal Receipts

Microelectronics Commons - Advanced Technology Development (ATD)

OSDRDT&EPartial Reconciliation0603669D8Z
What it is
Microelectronics Commons - Advanced Technology Development (ATD) — a research & development program run by OSD.
What changed
No FY25→26 comparison — trajectory data incomplete for this line.
Who gets it
No award linkage at high confidence.

Budget Figures

FY24 Actuals
$269.5M
FY25 Total
FY26 Request
FY25→26 Change
Budget Trajectory

Insufficient trajectory data for sparkline (only FY24 available).

FY2026 award data is a partial year — USASpending awards are reported on a rolling basis and the fiscal year does not close until September 30. why →

No research dossier for this program — dossiers cover 50 of 326 programs, ranked by FY2026 requested dollars. why →

Budget Line Items(workbook-cited)

Exhibit R-1

AccountOrgTypeAmount
Research, Development, Test and Evaluation, Defense-WideOSDFY24 Actuals$269.5M

Budget Details(R-2/P-40 facts)

ProjectAll Prior YearsFY24 ActualsFY25 TotalFY26 BaseFY26 Request
Program Element$0$269.5M$0$0$0
829: Microelectronics Research Maturation – Prototyping$0$0$255.8M$260.7M$260.7M
Program Element$0$0$265.1M$260.7M$260.7M
830: Workforce Development – Prototyping$0$0$9.33M$0$0

Program Narratives

MissionMicroelectronics Commons - 0400D

This Program Element supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. The Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) is executing the Microelectronics Commons (the Commons) activity pursuant to the Fiscal Year (FY) 2021 National Defense Authorization Act (NDAA) (Pub. L. 116-283), including the CHIPS for America Act, and funded through the CHIPS for America Defense Fund established by the CHIPS Act of 2022. The FY 2021 NDAA legislation significantly emphasizes solutions that promote the domestic on-shoring of capabilities to address economic and technology security concerns. Under FY 2021 NDAA Sec. 9903(b), the DOD is directed to establish a National Network for Microelectronics Research and Development (NNMRD) to enable the laboratory-to-fabrication transition of microelectronics innovations in the United States and to expand the global leadership in microelectronics of the United States. Specifically, the DOD is addressing a component of the NNMRD, the Commons, through a public-private partnership consisting of regional innovation hubs distributed across the U.S. to foster a pipeline of innovative ideas and talent residing in, for example, university labs and small business R&D teams. Background U.S. technological dominance in microelectronics materials, processes, devices, and architectural designs can only be sustained through the development of a robust domestic innovation ecosystem that fosters the rapid development and transition of novel concepts into commercially viable manufacturing processes. The U.S. innovation ecosystem has long been the driver of our nation’s technology leadership throughout the world. U.S. R&D kick-started the enormous semiconductor industry and continues to lead the world in developing the next generation of disruptive technologies including new materials, devices, circuits, architectures, and design tools. In recent years, the efficient domestic adoption of U.S. chip innovation has been threatened as emerging hardware technologies have become increasingly reliant on offshore sources for State of the Art (SOTA) manufacturing, prototyping, and investment. There are several significant hurdles that hardware startups face, including limited or expensive access to necessary facilities and design infrastructure, high costs of design intellectual property, limited expertise with hardware engineering, and high costs of prototyping. As a result, the number of U.S. hardware startups has dropped significantly and foreign investment in U.S.-based technology startups has enabled offshore fabrication and maturation of emerging technologies. To address these needs, OUSD(R&E) is standing up the Commons as a public private partnership, consisting of regional innovation hubs distributed across the U.S. to foster a pipeline of innovative ideas and talent residing in university labs and small business R&D teams. The partnership will provide resources for and access to specialized lab equipment, technical expertise, and connections to existing or upgraded prototyping facilities. Fabrication facilities (fabs) will help mature promising technologies and demonstrate the manufacturing and economic benefits of these innovations for dual-use application for defense and commercial sectors. The Commons will focus on critical, on-shore prototyping to transition innovation from universities, start-ups, and small companies to fabrication facilities (lab-to-fab transition). Key features are: • Creates and connects “Lab-to-Fab” testing/prototyping hubs to form a network focused on maturing emerging microelectronics technologies • Provides broad access to these prototyping hubs, potentially by augmenting facilities and enabling access to facilities within local semiconductor companies or FFRDCs. • Facilitates microelectronics education and training of students at local colleges and universities and grows a talent pipeline to bolster local semiconductor economies and contribute more broadly to the growth of a domestic semiconductor workforce. This program element focuses on the technology development activities of the Commons, including staffing at Commons hub facilities, advanced technology development, and significant prototyping activity. In addition, it provides for the establishment, staffing, and operation of the Microelectronics Commons Consortium Manager (CM), the overall management of the Commons, and will support the required physical, digital, and human infrastructure of the hubs.

MissionMicroelectronics Research Maturation – Prototyping

This project focuses on the advanced technology development activities of the Commons including prototyping of devices or components using new microelectronics materials, processes, device designs, and architectural designs. It will also enable the establishment and operation of a Commons Consortium Manager (CM), which will provide efficient coordination and administration of regional innovation hubs. The CM is tasked with operating the Commons network, in alignment with the OUSD(R&E) Commons vision to ensure DoD access to and benefit from resulting technologies. The project also supports the establishment of the Commons Hubs, which will be networks of regional capabilities organized in collaboration with the CM to address DoD and commercial needs and requirements. The Hubs may include existing facilities augmented to enhance intrinsic specializations in emerging areas of microelectronics. Each Hub will concentrate on one of six technical areas including: Secure Edge Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead Technologies. Core Facilities (i.e., fabs) are integral parts of the Hubs network that will provide key fabrication capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production. Additionally, the project will directly support early workforce development activities through the Commons network. Activities may span K-12, undergraduate, graduate and continuing education and may include, for example, establishment of PhD internships and post-doc training at Hub facilities and internships with Hub members.

MissionMicroelectronics Commons - 0403D

This Program supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. The Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) is executing the Microelectronics Commons (the Commons) activity pursuant to the Fiscal Year (FY) 2021 National Defense Authorization Act (NDAA) (Pub. L. 116-283), including and funded through the CHIPS for America Defense Fund established by the CHIPS Act of 2022. The FY 2021 NDAA legislation significantly emphasizes solutions that promote the domestic on-shoring of capabilities to address economic and technology security concerns. Under FY 2021 NDAA Sec. 9903(b), DoD is directed to establish a National Network for Microelectronics Research and Development (NNMRD) to enable the laboratory-to-fabrication transition of microelectronics innovations in the United States and to expand the global leadership in microelectronics of the United States. Specifically, DoD is addressing a component of the NNMRD, the Commons, through a public-private partnership consisting of regional innovation hubs distributed across the U.S. to foster a pipeline of innovative ideas and talent residing in, for example, university labs and small business R&D teams. Background U.S. technological dominance in microelectronics materials, processes, devices, and architectural designs can only be sustained through the development of a robust domestic innovation ecosystem that fosters the rapid development and transition of novel concepts into commercially viable manufacturing processes. The U.S. innovation ecosystem has long been the driver of our nation’s technology leadership throughout the world. U.S. R&D kick-started the enormous semiconductor industry and continues to lead the world in developing the next generation of disruptive technologies including new materials, devices, circuits, architectures, and design tools. In recent years, the efficient domestic adoption of U.S. chip innovation has been threatened as emerging hardware technologies have become increasingly reliant on offshore sources for State of the Art (SOTA) manufacturing, prototyping, and investment. There are several significant hurdles that hardware startups face, including limited or expensive access to necessary facilities and design infrastructure, high costs of design intellectual property, limited expertise with hardware engineering, and high costs of prototyping. As a result, the number of U.S. hardware startups has dropped significantly and foreign investment in U.S.-based technology startups has enabled offshore fabrication and maturation of emerging technologies. To address these needs, OUSD(R&E) is standing up the Commons as a public private partnership, consisting of regional innovation hubs distributed across the U.S. to foster a pipeline of innovative ideas and talent residing in university labs and small business R&D teams. The partnership will provide resources for and access to specialized lab equipment, technical expertise, and connections to existing or upgraded prototyping facilities. Fabrication facilities (fabs) will help mature promising technologies and demonstrate the manufacturing and economic benefits of these innovations for dual-use application for defense and commercial sectors. The Commons will focus on critical, on-shore prototyping to transition innovation from universities, start-ups, and small companies to fabrication facilities (lab-to-fab transition). Key features are: • Creates and connects “Lab-to-Fab” testing/prototyping hubs to form a network focused on maturing emerging microelectronics technologies • Provides broad access to these prototyping hubs, potentially by augmenting facilities and enabling access to facilities within local semiconductor companies or FFRDCs. • Facilitates microelectronics education and training of students at local colleges and universities and grows a talent pipeline to bolster local semiconductor economies and contribute more broadly to the growth of a domestic semiconductor workforce. This program element focuses on the technology development activities of the Commons, including staffing at Commons hub facilities, advanced technology development, and significant prototyping activity. In addition, it provides for the establishment, staffing, and operation of the Microelectronics Commons Consortium Manager (CM), the overall management of the Commons, and will support the required physical, digital, and human infrastructure of the hubs.

MissionMicroelectronics Research Maturation – Prototyping

This project focuses on the advanced technology development activities of the Commons including prototyping of devices or components using new microelectronics materials, processes, device designs, and architectural designs. It will also enable the establishment and operation of a Commons Consortium Manager (CM), which will provide efficient coordination and administration of regional innovation hubs. The CM is tasked with operating the Commons network, in alignment with the OUSD(R&E) Commons vision to ensure DoD access to and benefit from resulting technologies. The project also supports the establishment of the Commons Hubs, which will be networks of regional capabilities organized in collaboration with the CM to address DoD and commercial needs and requirements. The Hubs may include existing facilities augmented to enhance intrinsic specializations in emerging areas of microelectronics. Each Hub will concentrate on one of six technical areas including: Secure Edge Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead Technologies. Core Facilities (i.e., fabs) are integral parts of the Hubs network that will provide key fabrication capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production. Additionally, the project will directly support early workforce development activities through the Commons network. Activities may span K-12, undergraduate, graduate and continuing education and may include, for example, establishment of PhD internships and post-doc training at Hub facilities and internships with Hub members.

MissionWorkforce Development – Prototyping

This project focuses on workforce development activities that are inherent to the operation of the Commons, particularly in the advanced technology development phase. It will facilitate microelectronics education and training of students at local colleges and universities that are part of the Commons network and provide a pipeline to bolster local semiconductor economies and contribute more broadly to the growth of a domestic semiconductor workforce.

Accomplishments & Planned Programs (3)

Microelectronics Research Maturation – Prototyping

This effort focuses on the development and prototyping of promising new microelectronics materials, processes, devices, and architectural designs with potential DoD applications, development of these technologies, and operation of the CM. It will also support operation of regional Commons Hubs and initial selection and execution of Commons Projects in conjunction with activities funded by PEs 0602669D8Z and 0604669D8Z. Accomplishments • Awarded 8 Innovation Hubs • Hub Operations Investments: Approximately $374M • $38M in Electronic Design Automation (EDA) investments. • Hub Membership includes more than 1,300 hub members from 45 states, FY24 QTR4 • Hub Projects:34 projects awarded in FY24 QTR4 totaling $226M in funding across the 8 Microelectronics Commons Hubs • Services Projects: Services have received $80M over FY23 and FY24 to support prototype projects and technical management.

Microelectronics Research Maturation – Prototyping

This effort focuses on the development and prototyping of promising new microelectronics materials, processes, devices, and architectural designs with potential DoD applications, development of these technologies, and operation of the CM. It will also support operation of regional Commons Hubs and initial selection and execution of Commons Projects in conjunction with activities funded by PEs 0602669D8Z and 0604669D8Z. Accomplishments • Awarded 8 Innovation Hubs, FY23 QTR4 • Approximately $240M Awarded • Hub Membership includes more than 380 unique organizations from 35 states, FY24 QTR2 • Projects: Solicitation for Projects released in FY24 QTR1

Workforce Development – Prototyping

This effort will directly support workforce development activities through the Commons network through technology development and prototyping activities. Activities may span K-12, undergraduate, graduate and continuing education and may include, for example, establishment of PhD internships and post-doc training at Hub facilities and internships with Hub members. Additionally, it will develop training for the existing Commons workforce with potential for impact beyond the entities participating directly in the Commons Hubs. Accomplishments • Each of 8 Hubs were awarded funding to implement workforce development models specific to their Hub Needs - FY23 QTR4

No follow-the-dollar view — this program's awards haven't been crosswalked at high confidence (flows cover 17 of 326 programs). why →

Lobbying Mentions

Showing 25 of 26 from the Senate LDA disclosure database.

NORTHROP GRUMMAN CORPORATIONMicroelectronics2024

FY24 Defense Appropriations Act (H.R. 4365; S. 2587); FY24 Military Construction, Veterans Affairs, and Related Agencies

NORTHROP GRUMMAN CORPORATIONMicroelectronics2024

FY25 Defense Appropriations Act (H.R. 8774); FY25 Military Construction, Veterans Affairs, and Related Agencies Appropri

NORTHROP GRUMMAN CORPORATIONMicroelectronics2024

FY25 Defense Appropriations Act (H.R. 8774; S. 4921); FY25 Military Construction, Veterans Affairs, and Related Agencies

NORTHROP GRUMMAN CORPORATIONMicroelectronics2024

FY25 Defense Appropriations Act (H.R. 8774; S. 4921); FY25 Military Construction, Veterans Affairs, and Related Agencies

NORTHROP GRUMMAN CORPORATIONMicroelectronics2025

FY25 Defense Appropriations Act (H.R. 8774; S. 4921); FY25 Military Construction, Veterans Affairs, and Related Agencies

NORTHROP GRUMMAN CORPORATIONMicroelectronics2025

National Defense Authorization Act for Fiscal Year 2026 (S. 2296, H.R. 3838); FY2026 Defense Appropriations Act (H.R. 40

NORTHROP GRUMMAN CORPORATIONMicroelectronics2025

National Defense Authorization Act for Fiscal Year 2026 (S. 2296, H.R. 3838); FY2026 Defense Appropriations Act (H.R. 40

NORTHROP GRUMMAN CORPORATIONMicroelectronics2025

National Defense Authorization Act for Fiscal Year 2026 (S. 2296, H.R. 3838); FY2026 Defense Appropriations Act (H.R. 40

NORTHROP GRUMMAN CORPORATIONMicroelectronics2026

National Defense Authorization Act for Fiscal Year 2027; FY2027 Defense Appropriations Act; FY2026 Defense Appropriation

BAE SYSTEMS INCMicroelectronics2024

H.R. 2670 National Defense Authorization Act for Fiscal Year 2024 (P.L. 118-31), Including Intelligence Authorization Ac

BAE SYSTEMS INCMicroelectronics2024

H.R.8070, Servicemember Quality of Life Improvement and National Defense Authorization Act for Fiscal Year 2025; S.4638,

BAE SYSTEMS INCMicroelectronics2024

H.R.8070, Servicemember Quality of Life Improvement and National Defense Authorization Act for Fiscal Year 2025; S.4638,

BAE SYSTEMS INCMicroelectronics2024

H.R.8070, Servicemember Quality of Life Improvement and National Defense Authorization Act for Fiscal Year 2025; S.4638,

BAE SYSTEMS INCMicroelectronics2024

H.R.8070, Servicemember Quality of Life Improvement and National Defense Authorization Act for Fiscal Year 2025; S.4638,

BAE SYSTEMS INCMicroelectronics2025

House and Senate National Defense Authorization Act for Fiscal Year 2026 (Bill numbers TBD); House and Senate Intelligen

BAE SYSTEMS INCMicroelectronics2025

H.R.1, One Big Beautiful Bill Act; H.R.3838, Streamlining Procurement for Effective Execution and Delivery and National

BAE SYSTEMS INCMicroelectronics2025

H.R.3838, Streamlining Procurement for Effective Execution and Delivery and National Defense Authorization Act for Fisca

BAE SYSTEMS INCMicroelectronics2025

P.L. 119-60, National Defense Authorization Act for Fiscal Year 2026, Division F, Intelligence Authorization Act for Fis

BAE SYSTEMS INCMicroelectronics2026

House and Senate FY2027 National Defense Authorization Act (Bill Numbers TBD); House and Senate FY2027 Intelligence Auth

HONEYWELL INTERNATIONALMicroelectronics2024

Production Act Title III funding FY24 and FY25 National Defense Authorization Act FY24 and FY25 Defense Appropriations D

HONEYWELL INTERNATIONALMicroelectronics2024

Production Act Title III funding FY24 and FY25 National Defense Authorization Act FY24 and FY25 Defense Appropriations D

HONEYWELL INTERNATIONALMicroelectronics2025

Production Act Title III funding FY26 National Defense Authorization Act (S.2296/H.R.3838) FY26 Defense Appropriations (

HONEYWELL INTERNATIONALMicroelectronics2025

Production Act Title III funding FY26 National Defense Authorization Act (S.2296/H.R.3838)(S.1071) FY26 Defense Appropri

HONEYWELL INTERNATIONALMicroelectronics2026

Production Act Title III funding FY27 National Defense Authorization Act FY27 Defense Appropriations FY27 MilCon-VA Appr

Legislative & Regulatory Issues Related to Defense Matters: Public Law no. 118-31, National Defense Authorization Act fo

Primary Sources