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Fiscal Receipts

Microelectronics Commons - Applied Research

OSDRDT&EPartial Reconciliation0602669D8Z
What it is
Microelectronics Commons - Applied Research — a research & development program run by OSD.
What changed
No FY25→26 comparison — trajectory data incomplete for this line.
Who gets it
No award linkage at high confidence.

Budget Figures

FY24 Actuals
$65.1M
FY25 Total
FY26 Request
FY25→26 Change
Budget Trajectory

Insufficient trajectory data for sparkline (only FY24 available).

FY2026 award data is a partial year — USASpending awards are reported on a rolling basis and the fiscal year does not close until September 30. why →

No research dossier for this program — dossiers cover 50 of 326 programs, ranked by FY2026 requested dollars. why →

Budget Line Items(workbook-cited)

Exhibit R-1

AccountOrgTypeAmount
Research, Development, Test and Evaluation, Defense-WideOSDFY24 Actuals$65.1M

Budget Details(R-2/P-40 facts)

ProjectAll Prior YearsFY24 ActualsFY25 TotalFY26 BaseFY26 Request
825: Microelectronics Research Maturation-Development$0$0$60.5M$79.7M$79.7M
Program Element$0$65.1M$0$0$0
Program Element$0$0$72.2M$79.7M$79.7M
827: Workforce Development$0$0$11.7M$0$0

Program Narratives

MissionMicroelectronics Research Maturation-Development

This project focuses on the applied research activities of the Commons including the early research and development of new microelectronics materials, processes, devices, and architectural designs. It seeks to answer how new models, science, and technology can be leveraged to create a different manufacturing paradigm based on proven process tools in agile microelectronics fabrication facilities (fabs). The project also supports the establishment of the Commons Hubs, which will be networks of regional capabilities organized in collaboration with the Commons Consortium Manager (CM) to address DOD and commercial needs and requirements. The Hubs may include existing facilities augmented to enhance intrinsic specializations in emerging areas of microelectronics. Each Hub will concentrate on one of six technical areas including: Secure Edge Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead Technologies. Core Facilities (i.e., fabs) are integral parts of the Hubs network that will provide key fabrication capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production. This effort also includes early workforce development activities through the Commons network. Activities may span K-12, undergraduate, graduate and continuing education and may include, for example, establishment of PhD internships and post-doc training at Hub facilities and internships with Hub members.

MissionMicroelectronics Commons - 0400D

This Program supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. The Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) is executing the Microelectronics Commons (the Commons) activity pursuant to the Fiscal Year (FY) 2021 National Defense Authorization Act (NDAA) (Pub. L. 116-283), including the CHIPS for America Act, and funded through the CHIPS for America Defense Fund established by the CHIPS Act of 2022. The FY 2021 NDAA legislation significantly emphasizes solutions that promote the domestic on-shoring of capabilities to address economic and technology security concerns. Under FY 2021 NDAA Sec. 9903(b), the DOD is directed to establish a National Network for Microelectronics Research and Development (NNMRD) to enable the laboratory-to-fabrication transition of microelectronics innovations in the United States and to expand the global leadership in microelectronics of the United States. Specifically, the DOD is addressing a component of the NNMRD, the Commons, through a public-private partnership consisting of regional innovation hubs distributed across the U.S. to foster a pipeline of innovative ideas and talent residing in, for example, university labs and small business R&D teams. Background U.S. technological dominance in microelectronics materials, processes, devices, and architectural designs can only be sustained through the development of a robust domestic innovation ecosystem that fosters the rapid development and transition of novel concepts into commercially viable manufacturing processes. The U.S. innovation ecosystem has long been the driver of our nation’s technology leadership throughout the world. U.S. R&D kick-started the enormous semiconductor industry and continues to lead the world in developing the next generation of disruptive technologies including new materials, devices, circuits, architectures, and design tools. In recent years, the efficient domestic adoption of U.S. chip innovation has been threatened as emerging hardware technologies have become increasingly reliant on offshore sources for State of the Art (SOTA) manufacturing, prototyping, and investment. There are several significant hurdles that hardware startups face, including limited or expensive access to necessary facilities and design infrastructure, high costs of design intellectual property, limited expertise with hardware engineering, and high costs of prototyping. As a result, the number of U.S. hardware startups has dropped significantly and foreign investment in U.S.-based technology startups has enabled offshore fabrication and maturation of emerging technologies. To address these needs, OUSD(R&E) is standing up the Commons as a public private partnership, consisting of regional innovation hubs distributed across the U.S. to foster a pipeline of innovative ideas and talent residing in university labs and small business R&D teams. The partnership will provide resources for and access to specialized lab equipment, technical expertise, and connections to existing or upgraded prototyping facilities. Fabrication facilities (fabs) will help mature promising technologies and demonstrate the manufacturing and economic benefits of these innovations for dual-use application for defense and commercial sectors. The Commons will focus on critical, on-shore prototyping to transition innovation from universities, start-ups, and small companies to fabrication facilities (lab-to-fab transition). Key features are: • Creates and connects “Lab-to-Fab” testing/prototyping hubs to form a network focused on maturing emerging microelectronics technologies • Provides broad access to these prototyping hubs, potentially by augmenting facilities and enabling access to facilities within local semiconductor companies or FFRDCs. • Facilitates microelectronics education and training of students at local colleges and universities and grows a talent pipeline to bolster local semiconductor economies and contribute more broadly to the growth of a domestic semiconductor workforce. This program element focuses on the applied research activities of the Commons, including staffing at Commons hub facilities, early technology identification, preliminary microelectronics prototyping planning, and experimental tools.

MissionMicroelectronics Commons - 0403D

This Program supports the Department's initiatives to Build Sustainable and Long-Term Advantage, Defend the Homeland, and Deter Aggression. The Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) is executing the Microelectronics Commons (the Commons) activity pursuant to the Fiscal Year (FY) 2021 National Defense Authorization Act (NDAA) (Pub. L. 116-283), including and funded through the CHIPS for America Defense Fund established by the CHIPS Act of 2022. The FY 2021 NDAA legislation significantly emphasizes solutions that promote the domestic on-shoring of capabilities to address economic and technology security concerns. Under FY 2021 NDAA Sec. 9903(b), DoD is directed to establish a National Network for Microelectronics Research and Development (NNMRD) to enable the laboratory-to-fabrication transition of microelectronics innovations in the United States and to expand the global leadership in microelectronics of the United States. Specifically, DoD is addressing a component of the NNMRD, the Commons, through a public-private partnership consisting of regional innovation hubs distributed across the U.S. to foster a pipeline of innovative ideas and talent residing in, for example, university labs and small business R&D teams. U.S. technological dominance in microelectronics materials, processes, devices, and architectural designs can only be sustained through the development of a robust domestic innovation ecosystem that fosters the rapid development and transition of novel concepts into commercially viable manufacturing processes. The U.S. innovation ecosystem has long been the driver of our nation’s technology leadership throughout the world. U.S. R&D kick-started the enormous semiconductor industry and continues to lead the world in developing the next generation of disruptive technologies including new materials, devices, circuits, architectures, and design tools. In recent years, the efficient domestic adoption of U.S. chip innovation has been threatened as emerging hardware technologies have become increasingly reliant on offshore sources for State of the Art (SOTA) manufacturing, prototyping, and investment. There are several significant hurdles that hardware startups face, including limited or expensive access to necessary facilities and design infrastructure, high costs of design intellectual property, limited expertise with hardware engineering, and high costs of prototyping. As a result, the number of U.S. hardware startups has dropped significantly and foreign investment in U.S.-based technology startups has enabled offshore fabrication and maturation of emerging technologies. To address these needs, OUSD(R&E) is standing up the Commons as a public private partnership, consisting of regional innovation hubs distributed across the U.S. to foster a pipeline of innovative ideas and talent residing in university labs and small business R&D teams. The partnership will provide resources for and access to specialized lab equipment, technical expertise, and connections to existing or upgraded prototyping facilities. Fabrication facilities (fabs) will help mature promising technologies and demonstrate the manufacturing and economic benefits of these innovations for dual-use application for defense and commercial sectors. The Commons will focus on critical, on-shore prototyping to transition innovation from universities, start-ups, and small companies to fabrication facilities (lab-to-fab transition). Key features are: • Creates and connects “Lab-to-Fab” testing/prototyping hubs to form a network focused on maturing emerging microelectronics technologies • Provides broad access to these prototyping hubs, potentially by augmenting facilities and enabling access to facilities within local semiconductor companies or FFRDCs. • Facilitates microelectronics education and training of students at local colleges and universities and grows a talent pipeline to bolster local semiconductor economies and contribute more broadly to the growth of a domestic semiconductor workforce. This program focuses on the applied research activities of the Commons, including staffing at Commons hub facilities, early technology identification, preliminary microelectronics prototyping planning, and experimental tools.

MissionWorkforce Development

This project focuses on workforce development activities that are inherent to the operation of the Commons, particularly in the applied research phase of new technologies under investigation. It will facilitate microelectronics education and training of students at local colleges and universities that are part of the Commons network and provide a pipeline to bolster local semiconductor economies and contribute more broadly to the growth of a domestic semiconductor workforce.

MissionMicroelectronics Research Maturation-Development

This project focuses on the applied research activities of the Commons including the early research and development of new microelectronics materials, processes, devices, and architectural designs. It seeks to answer how new models, science, and technology can be leveraged to create a different manufacturing paradigm based on proven process tools in agile microelectronics fabrication facilities (fabs). The project also supports the establishment of the Commons Hubs, which will be networks of regional capabilities organized in collaboration with the Commons Consortium Manager (CM) to address DoD and commercial needs and requirements. The Hubs may include existing facilities augmented to enhance intrinsic specializations in emerging areas of microelectronics. Each Hub will concentrate on one of six technical areas including: Secure Edge Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead Technologies. Core Facilities (i.e., fabs) are integral parts of the Hubs network that will provide key fabrication capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production. Additionally, the project will directly support early workforce development activities through the Commons network. Activities may span K-12, undergraduate, graduate and continuing education and may include, for example, establishment of PhD internships and post-doc training at Hub facilities and internships with Hub members.

Accomplishments & Planned Programs (3)

Microelectronics Research Maturation – Development

This effort focuses on the identification of promising new microelectronics materials, processes, devices, and architectural designs with potential DoD applications, and early, applied research into these technologies. It will also support operation of regional Commons Hubs and initial selection and execution of Commons Projects in conjunction with activities funded by PEs 0603669D8Z and 0604669D8Z. Accomplishments • Awarded 8 Innovation Hubs • Hub Operations Investments: Approximately $374M • $38M in Electronic Design Automation (EDA) investments. • Hub Membership includes more than 1,300 hub members from 45 states, FY24 QTR4 • Hub Projects:34 projects awarded in FY24 QTR4 totaling $226M in funding across the 8 Microelectronics Commons Hubs • Services Projects: 24 projects awarded totaling $80M

Workforce Development

This effort will directly support early workforce development activities through the Commons network. Activities may span K-12, undergraduate, graduate and continuing education and may include, for example, establishment of PhD internships and post-doc training at Hub facilities and internships with Hub members. Accomplishments • Each of 8 Hubs were awarded funding to implement workforce development models specific to their Hub Needs - FY23 QTR4

Microelectronics Research Maturation – Development

This effort focuses on the identification of promising new microelectronics materials, processes, devices, and architectural designs with potential DoD applications, and early, applied research into these technologies. It will also support operation of regional Commons Hubs and initial selection and execution of Commons Projects in conjunction with activities funded by PEs 0603669D8Z and 0604669D8Z. Accomplishments • Awarded 8 Innovation Hubs, FY23 QTR4 • Approximately $240M Awarded • Hub Membership includes more than 380 unique organizations from 35 states, FY24 QTR2 • Projects: Solicitation for Projects released in FY24 QTR1

No follow-the-dollar view — this program's awards haven't been crosswalked at high confidence (flows cover 17 of 326 programs). why →

Lobbying Mentions

Showing 25 of 27 from the Senate LDA disclosure database.

NORTHROP GRUMMAN CORPORATIONMicroelectronics2024

FY24 Defense Appropriations Act (H.R. 4365; S. 2587); FY24 Military Construction, Veterans Affairs, and Related Agencies

NORTHROP GRUMMAN CORPORATIONMicroelectronics2024

FY25 Defense Appropriations Act (H.R. 8774); FY25 Military Construction, Veterans Affairs, and Related Agencies Appropri

NORTHROP GRUMMAN CORPORATIONMicroelectronics2024

FY25 Defense Appropriations Act (H.R. 8774; S. 4921); FY25 Military Construction, Veterans Affairs, and Related Agencies

NORTHROP GRUMMAN CORPORATIONMicroelectronics2024

FY25 Defense Appropriations Act (H.R. 8774; S. 4921); FY25 Military Construction, Veterans Affairs, and Related Agencies

NORTHROP GRUMMAN CORPORATIONMicroelectronics2025

FY25 Defense Appropriations Act (H.R. 8774; S. 4921); FY25 Military Construction, Veterans Affairs, and Related Agencies

NORTHROP GRUMMAN CORPORATIONMicroelectronics2025

National Defense Authorization Act for Fiscal Year 2026 (S. 2296, H.R. 3838); FY2026 Defense Appropriations Act (H.R. 40

NORTHROP GRUMMAN CORPORATIONMicroelectronics2025

National Defense Authorization Act for Fiscal Year 2026 (S. 2296, H.R. 3838); FY2026 Defense Appropriations Act (H.R. 40

NORTHROP GRUMMAN CORPORATIONMicroelectronics2025

National Defense Authorization Act for Fiscal Year 2026 (S. 2296, H.R. 3838); FY2026 Defense Appropriations Act (H.R. 40

NORTHROP GRUMMAN CORPORATIONMicroelectronics2026

National Defense Authorization Act for Fiscal Year 2027; FY2027 Defense Appropriations Act; FY2026 Defense Appropriation

BAE SYSTEMS INCMicroelectronics2024

H.R. 2670 National Defense Authorization Act for Fiscal Year 2024 (P.L. 118-31), Including Intelligence Authorization Ac

BAE SYSTEMS INCMicroelectronics2024

H.R.8070, Servicemember Quality of Life Improvement and National Defense Authorization Act for Fiscal Year 2025; S.4638,

BAE SYSTEMS INCMicroelectronics2024

H.R.8070, Servicemember Quality of Life Improvement and National Defense Authorization Act for Fiscal Year 2025; S.4638,

BAE SYSTEMS INCMicroelectronics2024

H.R.8070, Servicemember Quality of Life Improvement and National Defense Authorization Act for Fiscal Year 2025; S.4638,

BAE SYSTEMS INCMicroelectronics2024

H.R.8070, Servicemember Quality of Life Improvement and National Defense Authorization Act for Fiscal Year 2025; S.4638,

BAE SYSTEMS INCMicroelectronics2025

House and Senate National Defense Authorization Act for Fiscal Year 2026 (Bill numbers TBD); House and Senate Intelligen

BAE SYSTEMS INCMicroelectronics2025

H.R.1, One Big Beautiful Bill Act; H.R.3838, Streamlining Procurement for Effective Execution and Delivery and National

BAE SYSTEMS INCMicroelectronics2025

H.R.3838, Streamlining Procurement for Effective Execution and Delivery and National Defense Authorization Act for Fisca

BAE SYSTEMS INCMicroelectronics2025

P.L. 119-60, National Defense Authorization Act for Fiscal Year 2026, Division F, Intelligence Authorization Act for Fis

BAE SYSTEMS INCMicroelectronics2026

House and Senate FY2027 National Defense Authorization Act (Bill Numbers TBD); House and Senate FY2027 Intelligence Auth

HONEYWELL INTERNATIONALMicroelectronics2024

Production Act Title III funding FY24 and FY25 National Defense Authorization Act FY24 and FY25 Defense Appropriations D

HONEYWELL INTERNATIONALMicroelectronics2024

Production Act Title III funding FY24 and FY25 National Defense Authorization Act FY24 and FY25 Defense Appropriations D

HONEYWELL INTERNATIONALMicroelectronics2025

Production Act Title III funding FY26 National Defense Authorization Act (S.2296/H.R.3838) FY26 Defense Appropriations (

HONEYWELL INTERNATIONALMicroelectronics2025

Production Act Title III funding FY26 National Defense Authorization Act (S.2296/H.R.3838)(S.1071) FY26 Defense Appropri

HONEYWELL INTERNATIONALMicroelectronics2026

Production Act Title III funding FY27 National Defense Authorization Act FY27 Defense Appropriations FY27 MilCon-VA Appr

Support on behalf of client H.R. 1586 and S. 796, both entitled The Forest Protection and Wildland Firefighter Safety Ac

Primary Sources