Advanced Electronics Technologies

The Continuous-correctness On Opaque Processors (COOP) program will validate that continuous correctness of software enables adoption of the latest processors with low overhead. Instead of creating new threat-specific signatures to detect the threats, COOP detects the physical manifestations of software errors and continuously corrects the errors with mathematical guarantees. COOP intends to transition to commercial companies and DoD system designers. Beginning in FY 2026, this program will be funded in PE 0603469E, Project AET-02.

DARPA's Supply Chain and Logistics in Electronic Technology program is developing the technologies to help ensure a robust and secure domestic supply chain for advanced microsystems. This includes the design, assembly, packaging, and testing technologies for advanced microsystems that exploits and extends beyond commercial activities. It takes advantage of innovations in photonics, optics, materials, and advanced three-dimensional heterogeneous integration (3DHI) for the highest performance electronics technology. In doing so, the program is working to revolutionize domestic industry and enable safe and reliable access to disruptive technology.

The Next Generation Microelectronics Manufacturing (NGMM) program is creating a domestic capability for research, development, and production of three-dimensional heterogeneously-integrated (3DHI) microelectronics, with the goal of sustaining U.S. leadership and innovation in microelectronics manufacturing. The NGMM program aims to advance the state of the art in 3DHI microelectronics through the formation of a domestic open-access prototyping and pilot line center accessible to users in academia, government, and industry. The center will offer equipment resources driving common manufacturing processes for R&D prototyping and a common three-dimensional assembly design kit (3D-ADK), 3DHI electronic design automation (EDA) workflows, simulation / emulation methodologies using digital twins, and test standards to simplify design and performance estimation of 3DHI prototypes. The center will foster a collaborative infrastructure between the foundry, packaging engineers, and EDA engineers to support 3D-ADK development and updates that track with foundry process design kits (PDKs). There will be shared, co-located fabrication, assembly, metrology, and test equipment with interface and process standardization to reduce prototyping cycle time aided by automation of 3DHI fabrication, assembly, and test processes. The center will also create roadmaps to define current and expected future capabilities and business practices. The end goal of the program is to establish a self-sustaining 3DHI manufacturing center at an existing facility that is owned and operated by a non-federal entity. Success will be measured by the ability to support the design, fabrication, assembly, and test of a wide range of high-performance 3DHI microsystems at reasonable cost with cycle times supporting fast-paced innovative research. Applied research associated with this effort is funded within PE 0602716E, Project ELT-02. Beginning in FY 2026, this program will be funded in PE 0603469E, Project AET-02.

The Wideband Secured and Protected Emitter and Receiver (WiSPER) program aimed to develop an ultra-broadband technology platform to demonstrate a robust, secure, and protected communication link. WiSPER technology provided high signal coding gain to deliver a secured and protected link with significantly enhanced capacity for next generation DoD communications. WiSPER technology addressed military needs for assured communications, throughput, security, and size, weight, and power limitations of future command, control, communications, computers, intelligence, surveillance and reconnaissance missions. The program developed an ultra-broadband compact antenna, radio frequency front-end electronics, mixed-signal circuits, and waveform technologies. The WiSPER program culminated with the integration and demonstration of a secured communication link. Technologies developed under the WiSPER program are planned for transition to the Services.

The Box Kick program is developing a capability to engage and defeat raids of adversary subsonic cruise missiles and unmanned aerial systems at low cost while preserving more capable and expensive weapons for higher-end threats. The program will integrate this capability into existing platforms with little-to-no platform modifications required. Technology developed under this program is planned for transition to the Services. Beginning in FY 2026, this program will be funded in PE 0603467E, Project DAT-01.

The Modular Efficient Laser Technology (MELT) program will demonstrate the first compact, high-power laser tile as the key building block to enable the next generation of scalable high energy laser (HEL) sources for laser weapon systems (LWS). Today's LWS use fiber laser array HEL sources, complex optical benches, and beam directors. These systems are large and heavy, contain large numbers of individual components, and require skilled labor to fabricate and integrate. This makes current LWS difficult and costly to manufacture, limiting their deployment and application. MELT will leverage recent advances in coherent beam combining and photonic integrated circuits (PICs) fabrication techniques to develop tiled arrays integrated with semiconductor-based optical systems, low-loss waveguides, optical interconnects, and application-specific integrated circuits (ASIC) into a compact laser tile that can be integrated with a supporting backplane to provide scalable HEL sources. This will provide the LWS developer a scalable HEL architecture that maintains excellent beam quality and allows LWS deployment on size, weight, and power (SWaP)-constrained platforms. MELT will leverage a mature industrial base for semiconductor manufacturing, as well as recent advances in photonic integrated circuits, coherent beam combining algorithms, semiconductor cooling techniques, and optical lithography to achieve its program goals. Technologies from this program are intended for transition to Army, Air Force, and Navy. Beginning in FY 2026, this program will be funded in PE 0603469E, Project AET-02.